Korean exhibition organiser Kyungyon Exhibition and the packaging trade publication Monthly Packaging promoted ESG PACK 2027 at TOKYO PACK 2026 and discussed future exchange with representatives of the Japan Packaging Institute (JPI), according to an October 19 report by Korea’s Industrial Daily. The reported topics included exhibitions, conferences, experts and business contacts. The operative word is discussed. No joint hosting arrangement for the Korean event, confirmed JPI participation or commercial matchmaking contract was announced in the cited report.
Distinguish two events and three dates
JPI’s TOKYO PACK 2026 took place at Tokyo Big Sight October 14–16. Its official programme lists keynotes and symposium activity for the Japanese 2026 event. Those sessions are not evidence of a jointly organised programme at next year’s Korean exhibition.
The Korean organiser’s official ESG PACK overview identifies April 20–23, 2027, at KINTEX Exhibition Center 1, names Kyungyon Exhibition as organiser and lists areas including paper-and-pulp packaging, recycling-oriented design and testing or certification. The overview we checked does not name JPI as a co-organiser or confirmed participant. An announcement not yet found is not proof that future participation cannot occur.

An exchange discussion is not a contract
Industrial Daily reports that the parties plan to discuss specific cooperation and implementation details further. The reported meeting and promotional booth are supported by that field report; we did not find a separate JPI announcement of a 2027 joint project. The account is useful for identifying potential collaboration, but it is not a document guaranteeing participation terms, allocated buyers, fee levels or a shared seminar.
Packaging-machinery and testing firms can plan around the published exhibition dates and subject areas. They should add a Japan-linked session or buyer programme to their budget only after the organisers disclose the actual schedule, participating institution and terms.

About the Author
PackingMaster: Editor of PaperPackLog, covering paper-packaging industry developments, products and technical decisions.
References
- Industrial Daily, Korea-Japan packaging exhibition exchange discussions at TOKYO PACK, October 19, 2026 — Sole field report on the meeting, booth and planned further discussions.
- Official TOKYO PACK 2026 website — Japanese 2026 event programme.
- Official ESG PACK overview — Korean 2027 dates, venue, organiser and fields.
